Ulwazi

Uhlolojikelele lwe-Topcon photovoltaic module ubuchwepheshe kanye nezinzuzo

Ubuchwepheshe bemojula ye-TOPCon (Tunnel Oxide Passivated Contact) ye-photovoltaic (PV) bumele intuthuko yakamuva embonini yelanga ukuze kuthuthukiswe ukusebenza kahle kwamaseli nokunciphisa izindleko. Ingqikithi yobuchwepheshe be-TOPCon ilele esakhiweni sayo sokuxhumana esiyingqayizivele, esinciphisa ngempumelelo ukuhlanganisa kabusha kwenkampani yenethiwekhi endaweni yeseli, ngaleyo ndlela kuthuthukise ukusebenza kahle kokuguqulwa kweseli.

Amaphuzu Avelele Ezobuchwepheshe

1. Passivation Contact Isakhiwo: Amaseli e-TOPCon alungisa ungqimba lwe-silicon oluyi-super-thin oxide (1-2nm) ngemuva kwewafa ye-silicon, elandelwa ukubekwa kongqimba lwe-polycrystalline silicon oludotshiwe. Lesi sakhiwo asihlinzeki nje ngokudlula isikhombimsebenzisi esihle kakhulu kodwa futhi sakha isiteshi sokuthutha esikhethiwe, esivumela abathwali abaningi (ama-electron) ukuba badlule ngenkathi kuvimbela abathwali abambalwa (izimbobo) ukuthi bangaphinde bahlangane, ngaleyo ndlela bandise ngokuphawulekayo amandla kagesi eseli evulekile (Voc) futhi bagcwalise. isici (FF).

2. Ukuguqulwa Okuphezulu Ngempumelelo: Ukusebenza kahle okuphezulu kwethiyori kwamaseli e-TOPCon kuphezulu njengokungu-28.7%, kuphezulu kakhulu kunamaseli e-PERC ohlobo lwe-P angu-24.5%. Ekusetshenzisweni okungokoqobo, ukusebenza kahle kokukhiqiza okukhulu kwamaseli e-TOPCon kudlule ama-25%, okungenzeka kube ngcono nakakhulu.

3. I-Low Light-Induced Degradation (LID): Ama-silicon wafers wohlobo lwe-N anokonakala okuphansi okubangelwa ukukhanya, okusho ukuthi amamojula e-TOPCon angagcina ukusebenza okuphezulu kokuqala ekusetshenzisweni kwangempela, anciphise ukulahlekelwa kokusebenza esikhathini eside.

4. I-Optimized Temperature Coefficient: I-coefficient yokushisa yamamojula we-TOPCon ingcono kunamamojula we-PERC, okusho ukuthi ezindaweni ezishisa kakhulu, ukulahlekelwa kwamandla okukhiqiza amamojula we-TOPCon kuncane, ikakhulukazi ezindaweni ezishisayo neziwugwadule lapho le nzuzo ibonakala ngokukhethekile.

5. Ukuhambelana: Ubuchwepheshe be-TOPCon bungahambisana nemigqa yokukhiqiza ye-PERC ekhona, edinga kuphela izisetshenziswa ezimbalwa ezengeziwe, ezifana ne-boron diffusion kanye nemishini yokubeka ifilimu emincane, ngaphandle kwesidingo sokuvula nokuqondanisa ngemuva, ukwenza inqubo yokukhiqiza ibe lula.

Inqubo Yokukhiqiza

Inqubo yokukhiqiza yamaseli e-TOPCon ikakhulukazi ihlanganisa lezi zinyathelo ezilandelayo:

1. Ukulungiswa kweSilicon Wafer: Okokuqala, ama-wafers e-silicon asetshenziswa njengesisekelo seseli. Amawafa ohlobo lwe-N anesikhathi sempilo yenkampani yenethiwekhi ephezulu kanye nokusabela okungcono okubuthakathaka kokukhanya.

2. I-Oxide Layer Deposition: Isendlalelo se-silicon esincanyana kakhulu sifakwe ngemuva kwe-silicon wafer. Ugqinsi lwalolu ungqimba lwe-silicon ye-oxide ngokuvamile luphakathi kuka-1-2nm futhi luyisihluthulelo sokuthola ukuthintana kwe-passivation.

3. I-Doped Polycrystalline Silicon Deposition: I-doped polycrystalline silicon layer ifakwe kungqimba lwe-oxide. Lesi sendlalelo se-silicon ye-polycrystalline singafinyelelwa ngokusebenzisa i-low-pressure chemical vapor deposition (LPCVD) noma ubuchwepheshe be-plasma-enhanced chemical vapor deposition (PECVD).

4. Ukwelashwa Kwe-Anealing: Ukwelashwa kwe-annealing okunokushisa okuphezulu kusetshenziselwa ukushintsha icrystallinity yongqimba lwe-silicon ye-polycrystalline, ngaleyo ndlela kusebenze ukusebenza kwe-passivation. Lesi sinyathelo sibalulekile ukuze kuzuzwe ukuhlanganiswa kabusha kwesixhumi esibonakalayo esiphansi kanye nokusebenza kahle kwamaseli.

5. Ukwenziwa kwensimbi: Imigqa yegridi yensimbi kanye namaphoyinti okuxhumana akhiwa ngaphambili nangemuva kweseli ukuze kuqoqwe abathwali abakhiqizwe isithombe. Inqubo yokwenza i-metallization yamaseli e-TOPCon idinga ukunakwa okukhethekile ukugwema ukulimaza ukwakheka kokuxhumana kwe-passivation.

6. Ukuhlola Nokuhlunga: Ngemuva kokuthi ukukhiqizwa kwamaseli sekuqediwe, ukuhlolwa kokusebenza kukagesi kuyenziwa ukuze kuqinisekiswe ukuthi amaseli ahlangabezana nezindinganiso zokusebenza ezinqunywe kusengaphambili. Amaseli abe esehlelwa ngokuvumelana nemingcele yokusebenza ukuze ahlangabezane nezidingo zezimakethe ezahlukene.

7. I-Module Assembly: Amaseli ahlanganiswe abe amamojula, ngokuvamile ambozwe ngezinto ezifana nengilazi, i-EVA (i-ethylene-vinyl acetate copolymer), ne-backsheet ukuze avikele amaseli futhi anikeze ukusekela kwesakhiwo.

Izinzuzo Nezinselele

Izinzuzo zobuchwepheshe be-TOPCon zilele ekusebenzeni kwayo okuphezulu, i-LID ephansi, kanye ne-coefficient yezinga lokushisa elihle, konke okwenza amamojula we-TOPCon asebenze kahle futhi abe nesikhathi eside sokuphila ezinhlelweni zokusebenza zangempela. Kodwa-ke, ubuchwepheshe be-TOPCon buphinde bubhekane nezinselelo zezindleko, ikakhulukazi mayelana nokutshalwa kwezimali kwemishini yokuqala kanye nezindleko zokukhiqiza. Ngokuthuthuka okuqhubekayo kwezobuchwepheshe kanye nokwehliswa kwezindleko, kulindeleke ukuthi izindleko zamaseli e-TOPCon zizokwehla kancane kancane, zithuthukise ukuncintisana kwazo emakethe ye-photovoltaic.

Kafushane, ubuchwepheshe be-TOPCon buyisiqondiso esibalulekile sokuthuthukiswa kwemboni ye-photovoltaic. Ithuthukisa ukusebenza kahle kokuguqulwa kwamaseli elanga ngokusebenzisa emisha yezobuchwepheshe ngenkathi igcina ukuhambisana nemigqa yokukhiqiza ekhona, ihlinzeka ngokusekela okuqinile kwezobuchwepheshe ekuthuthukisweni okusimeme kwemboni ye-photovoltaic. Ngokuqhubeka okuqhubekayo kwezobuchwepheshe kanye nokunciphisa izindleko, amamojula we-TOPCon photovoltaic kulindeleke ukuthi abuse imakethe ye-photovoltaic esikhathini esizayo.